ECE 210 INTRODUCTION TO ELECTRIC CIRCUITS (3-0-3)(F,S). Fundamental laws, basic network analysis, and circuit theorems. Capacitors, inductors, and operational-amplifier circuits. First- and second-order circuits. Sinusoidal steady-state analysis of AC circuits. Introduction to computer-aided circuit simulation. PREREQ: PHYS 212. PRE/COREQ: MATH 333.
ECE 212 CIRCUIT ANALYSIS AND DESIGN (3-0-3)(F,S). Single-phase and three-phase AC circuits. Mutual inductance and transformers. Laplace transforms and circuit applications. Transfer functions, Bode plots, frequency response, and resonant circuits. Fourier series and filter circuit design. Two-port networks. PREREQ: ECE 210 and MATH 333. COREQ: ECE 212L.
ECE 212L CIRCUIT ANALYSIS AND DESIGN LAB (0-3-1)(F,S). Lab work to accompany ECE 212 Circuit Analysis and Design. COREQ: ECE 212.
ECE 230 DIGITAL SYSTEMS (3-0-3)(F,S). Number systems, Boolean algebra, logic gates, Karnaugh maps, combinatorial circuits, flip-flops, registers, counters, sequential state-machines and introduction to Hardware Description Languages (HDL). Construction of small digital systems. PREREQ: CS 121. COREQ: ECE 230L.
ECE 230L DIGITAL SYSTEMS LAB (0-3-1)(F,S). Design, construction, and test of small digital logic circuits using TTL and CMOS chips. Use of FPGA-based prototyping boards with schematic capture and simulation. COREQ: ECE 230.
ECE 300 ELECTROMAGNETIC AND WAVE THEORY (3-0-3)(F). Electrostatic fields, potentials, Gauss’ law, solutions of Laplace’s equation, electrostatics of conductors and dielectric materials, vector potentials, Maxwell’s equations, and transmission line theory. PREREQ: ECE 212, MATH 275, MATH 333, and PHYS 212.
ECE 310 MICROELECTRONIC CIRCUITS (3-0-3)(F,S). Circuit design and analysis using diodes, bipolar junction transistors, and MOSFETs. Introduction to design with op-amps. Circuit simulation with SPICE. PREREQ: ECE 212, ECE 230, and CHEM 111. COREQ: ECE 310L.
ECE 310L MICROELECTRONIC CIRCUITS LAB (0-3-1)(F,S). Hands-on design, construction, and test of electronic circuits using signal generators, power supplies, and oscilloscopes. COREQ: ECE 310.
ECE 311 MICROELECTRONICS II (3-0-3)(Offered as Justified). Microelectronics II continues the Microelectronics course with coverage of non-ideal op amps and feedback stability, BJT and MOSFET single transistor amplifier design, differential amplifiers and operational amplifier design, amplifier frequency response, transistor feedback amplifiers, and oscillators. This course is ideal for any student that wants to further their understanding and application of microelectronic circuits. PREREQUISITES: ECE 310.
ECE 320 SEMICONDUCTOR DEVICES (3-0-3)(F). Fundamentals of solid-state electronic devices. Energy band theory, drift, diffusion, generation and recombination of carriers. Physics, modeling, and biasing of diodes, MOSFETs, BJTs. Electronics of metal-semiconductor junctions and the MOS capacitor structure. SPICE model development. Introduction to 2-D device design software. PREREQ: ECE 310.
ECE 330 MICROPROCESSORS (3-0-3)(F,S). Microprocessor architecture, software development tools, and hardware interfacing. Emphasis is placed on 16 and 32 bit microprocessor systems. Machine and assembly language programming, instruction set, addressing modes, programming techniques, memory systems, I/O interfacing, and interrupt handling are among the topics studied with practical applications in data acquisition, control, and interfacing. PREREQ: ECE 230.
ECE 330L MICROPROCESSORS LAB (0-3-1)(F,S). Lab work on microprocessors using a Macroassembler and a hardware experimentation kit. COREQ: ECE 330.
ECE 337 (CS 330)(ENGR 337)(MATH 337)(ME 337) INTRODUCTION TO SECURITY IN CYBER-PHYSICAL SYSTEMS (3-0-3)(F). Overview of systems security: hardware, software, encryption, and physical security. Includes multiple modules: system security, physical issues in security, hardware and firmware security issues, industrial control, and all things connected to the internet. PREREQ: CS 117 or CS 121, PHYS 211, and MATH 187 or MATH 189 or MATH 360 or MATH 361.
ECE 340 (MSE 410) ELECTRICAL PROPERTIES OF MATERIALS (3-0-3)(F/S). Physical principles underlying the electrical properties of metals, insulators and semiconductors. The effects of energy band structure, thermal properties and impurities on electrical conduction. Concepts covered are applied to electrical devices including nanodevices, MOSFETs and optoelectronic devices. May be taken for MSE or ECE credit, but not both. PREREQ: MSE 245, MATH 333, ENGR 240 or ECE 210, and PHYS 309 or ECE 212.
ECE 350 SIGNALS AND SYSTEMS (3-0-3)(F,S). Signal and system properties. Convolution. Fourier and Laplace techniques. Basics of amplitude modulation. Discrete-time systems theory including sampling and aliasing, z-transforms, and digital filters. PREREQ: ECE 212. COREQ: ECE 350L and MATH 360 or MATH 361.
ECE 350L SIGNALS AND SYSTEMS LAB (0-3-1)(F,S). Lab work on signals and systems. COREQ: ECE 350.
ECE 371 SMART GRID AND RENEWABLE ENERGY SYSTEMS (3-0-3)(S). A survey of distributed energy generation (DEG) resources to include solar, wind, biomass, grid-level energy storage, as compared to traditional electric power production, transmission, and distribution. Advanced metering infrastructure (AMI) cyber security, and supervisory control and data acquisition (SCADA) as well as technical, economic, and system integration issues are examined. PREREQ: ECE 212 or ENGR 240.
ECE 360 (ME 360) SYSTEM MODELING AND CONTROL (3-0-3)(F). Modeling and simulation of physical systems. Transfer functions, block diagrams, step responses and stability. Design of feedback control systems in the Laplace domain. May be taken for ECE or ME credit, but not both. PREREQ: MATH 333, PHYS 212.
ECE 380 ELECTRICAL ENGINEERING PRACTICE (2-0-2)(S). Fundamentals in the practice of Electrical Engineering as a profession. Topics include written and oral communication within Electrical Engineering; engineering project management and economics; design of experiment, systems, processes, and devices; test, reliability, lifetime, and failure analysis; manufacturing; ethics; sustainability; and engineering professionalism. PREREQ: ENGL 102, ENGL 202 and ECE 212. COREQ: ECE 310 and ECE 380L.
ECE 380L ELECTRICAL ENGINEERING PRACTICE LAB (0-3-1)(S). Laboratory work on Electrical Engineering Practice. PREREQ: ENGL 102. COREQ: ECE 380.
ECE 400 APPLIED ELECTROMAGNETICS (3-0-3)(S). An applied study of electromagnetic theory and its applications to wave propagation in bounded structures, scattering and diffraction, antenna theory, S-parameters, and microwave engineering. PREREQ: ECE 300 or PHYS 382.
ECE 410 DIGITAL INTEGRATED CIRCUIT DESIGN (3-0-3)(F). An introduction to CMOS IC design, layout, and simulation. MOSFET operation and parasitics. Digital design fundamentals: digital logic families, latches, flip-flops, sequential logic and datapath subsystems. EDA tools for design, simulation, parasitic extraction and chip tape-out. PREREQ: ECE 310.
ECE 411 CMOS ANALOG IC DESIGN (3-0-3)(S). An introduction to CMOS analog integrated circuit design. High-frequency models for MOSFET, current mirrors, voltage references, negative feedback systems and stability, amplifiers, frequency compensation and op-amps. PREREQ: ECE 310.
ECE 413 RF DESIGN (3-0-3)(S). Design of wireless systems and RF circuits including amplifiers, oscillators, mixers, filters, and matching networks. Comparison of semiconductor device type characteristics and applications. Use of various analysis, simulation, characterization, and measurement tools for low-noise design, stability analysis, distortion analysis and mitigation, frequency synthesis, and transmission line characterization. PREREQ: ECE 300, ECE 310, ECE 350.
ECE 418 MEMORY AND PLL IC DESIGN (3-0-3)(F). Transistor-level design of memory and clock synchronization circuits: DRAM, SRAM, Flash, and ReRAM, design and analysis of Phase-locked Loops (PLLs), Delay-locked Loops (FHs) and Clock-Data Recovery (CDR) circuits. PREREQ: ECE 410.
ECE 420 ADVANCED DEVICE DESIGN AND SIMULATION (3-0-3)(S). Energy band formation, semiconductor carrier statistics, and carrier transport including recombination and generation mechanisms. Physical operation and design of metal-semiconductor contacts, pn-junction diodes, MOS capacitors, and MOSFETs with both analytical and numerical approaches. Scaling rules, short-channel effects, and nanoscale transistors are also discussed. PREREQ: ECE 310, and ECE 320 or ECE 340.
ECE 430 DIGITAL HARDWARE DESIGN (3-0-3)(F). Advanced topics in digital system design emphasizing the specification and design of complex digital hardware systems using Hardware Description Languages (HDL) and High Level Synthesis (HLS). Applications include design of synchronous state machines, asynchronous digital systems, crossing multiple clock domains, and cryptography protocols for cyber-physical systems security. Design, simulation and implementation on FPGA development boards. PREREQ: ECE 230 and CS 121.
ECE 432 (CS 441) COMPUTER ARCHITECTURE (3-0-3)(F). Structure of computer systems using processors, memories, and input/output (I/O) devices as building blocks. Computer system instruction set design and implementation, including memory hierarchies, microprogramming, pipelining and multiprocessors. Issues and trade-offs involved in the design of computer system architectures with respect to the design of instruction sets. Cyber-physical security implications of architectural design choices. May be taken for either CS or ECE credit, but not both. PREREQ: ECE 330.
ECE 433 EMBEDDED AND PORTABLE COMPUTING SYSTEMS (3-0-3)(S). Microcontrollers and their use in embedded systems and sensors applications. Power consumption, software development, interprocessor communication, and interfacing with sensors, actuators, and input/output devices. Cyber-physical systems security topics including secure coding, buffer overflow, and physical security. An embedded system project is designed and built. PREREQ: ECE 330.
ECE 434 (CS 425) COMPUTER NETWORKS (3‐0‐3)(F). Concepts and implementation of networking: physical, link, network, transport, and application layer protocols. Wireless networking and security basics. PREREQ: CS 253 and CS 321.
ECE 436 DIGITAL SYSTEMS RAPID PROTOTYPING (3-0-3)(S). Hardware description languages and hardware programming languages as a practical means to simulate/implement hybrid sequential and combinational systems. Actual design and implementation of sizeable digital design problems using the most up-to-date industry Computer Aided Design tools and Field-Programmable Gate Arrays. PREREQ: ECE 430.
ECE 440 INTRO TO INTEGRATED CIRCUIT PROCESSING (3-0-3)(F)(Even years). Fundamentals of integrated circuit fabrication technology; semiconductor substrates; theory of unit processes such as diffusion, oxidation, ion implantation, rapid thermal processing, photolithography, wet etching and cleaning, dry etching, thin-film deposition; chemical mechanical polishing; process integration; metrology; statistical process control; TCAD. PREREQ: ECE 320 or ECE 340/MSE 410. COREQ: ECE 440L.
ECE 440L INTRO TO INTEGRATED CIRCUIT PROCESSING LAB (0-3-1)(F). Semiconductor cleanroom practices; heavy lab safety; students will experiment with semiconductor processes and fabricate and test simple structures in lab. COREQ: ECE 440.
ECE 441 ADVANCED SILICON TECHNOLOGY (3-0-3)(S)(Odd years). Advanced technology for unit processes such as diffusion, oxidation, ion implantation, thin film deposition, etching, rapid thermal processing, chemical mechanical polishing, and lithography. CMOS and bipolar process integration. PREREQ: ECE 440.
ECE 442 PHOTOLITHOGRAPHY (3-0-3)(S). Principles of optics, diffraction, interference, superposition of waves, imaging systems, fundamentals of microlithography, resolution, contact and projection lithography, photoresist processing, metrology. Phase shift masks, anti-reflective coatings, deep-ultraviolet lithography, off-axis annular illumination. PREREQ: ECE 440.
ECE 443 INTRODUCTION TO MEMS (3-0-3)(F/S). Overview of MEMS; MEMS device physics including beam theory, electrostatic actuation, capacitive and piezoresistive sensing, thermal sensors and actuators; basic MEMS fabrication techniques; MEMS technologies: bulk micromachining, surface micromachining, and LIGA; MEMS design and modeling; case studies in various MEMS systems. PREREQ: ECE 440.
ECE 451 COMMUNICATION SYSTEMS (3-0-3)(S). Signals, noise, propagation and protocol in analog and digital communication systems. Bandwidth, Fourier transforms, signal to noise ratio and receiver noise figures. Introduction to modern wireless communication systems such as cellular, wireless data and satellite data systems. Introduction to physical layer security and the principles of encryption for communication systems. PREREQ: ECE 350, and MATH 360 or MATH 361.
ECE 451L COMMUNICATION SYSTEMS LAB (0-3-1)(S). Lab experience accompanying ECE 451 utilizing AM/FM modulation, spectrum analysis, receiver design and analysis. PREREQ: ECE 350. COREQ: ECE 451.
ECE 452 WIRELESS COMMUNICATIONS (3-0-3)(F). Modern cellular communication systems, including propagation, handoff, noise, and interference studies. CDMA and other spread-spectrum systems. PREREQ: ECE 451.
ECE 454 DIGITAL SIGNAL PROCESSING (3-0-3)(F). Modern digital signal processing in engineering systems. Review of continuous-time and discrete-time signals, spectral analysis; design of FIR and IIR digital filters. Fast Fourier Transform, two-dimensional signals, realization structure of digital filters, and filter design. PREREQ: ECE 350.
ECE 456 PATTERN RECOGNITION AND MACHINE LEARNING (3-0-3)(Offered as Justified). Basic concepts of statistical and neural pattern recognition. Structure of pattern classification problems. Mathematics of statistical decision theory; multivariate probability functions, discriminant, parametric and nonparametric techniques. Bayesian and maximum likelihood estimation, feature selection, dimensionality reduction, neural network and deep learning recognition, and clustering. Includes applications to cyber-physical security. PREREQ: CS 221, and either MATH 360 or MATH 361.
ECE 457 DIGITAL IMAGE PROCESSING (3-0-3)(F). Pictures and their computer representation. Image digitization, transformation, and prediction methods. Digital enhancement techniques, histogram equalization, restoration, filtering and edge detection. Color models and transformations. Wavelets and morphological algorithms. PREREQ: ECE 350 and CS 121.
ECE 461 (ME 461) CONTROL SYSTEMS (3-0-3)(Offered as Justified). Time and frequency domain analysis and design of feedback systems using classical and state space methods. Observability, controllability, pole placement, and observers. May be taken for ECE or ME credit, but not both. PREREQ: ECE 360 or ME 360.
ECE 470 ELECTRIC MACHINES (3-0-3)(S). Magnetic materials and magnetic circuits. Principles of electromechanical energy conversion, energy and coenergy concepts, forces and torques of electromagnetic origin. Introduction to rotating machines including synchronous machines and induction machines. PREREQ: ECE 212, ECE 300.
ECE 472 POWER ELECTRONICS (3-0-3)(F). Power electronic switches, diode and controlled rectifiers, AC-AC phase control, DC-DC converters, inverters, introduction to electric drives and power quality fundamentals. PREREQ: ECE 212.
ECE 473 POWER SYSTEM ANALYSIS I (3-0-3)(F). Three-phase AC systems, generators, transformers, transmission lines, one-line diagrams, per-unit system, network calculations, load flow studies, power system operation. Introduction to cyber-physical security in power systems, cyber threats and case studies. PREREQ: ECE 212. COREQ: ECE 300.
ECE 474 POWER SYSTEM ANALYSIS II (3-0-3)(S). Fault analysis, symmetrical components, power system transients, protection and relaying, transient stability, power system operation and control, power system economics, power quality, and power system reliability. Components of a SCADA system, vulnerabilities, communication protocols, cyber-physical security issues, and compliance with standards. PREREQ: ECE 473.
ECE 480 SENIOR DESIGN PROJECT I (2-3-3)(F). Part one of the capstone design experience integrating previous design work with design theory and methodology. Applied through individual projects with fixed specifications requiring effective use of engineering skills including: time management, design trade-off analysis, SPICE simulation, PCB layout, and test/debug of the constructed design. Written reports are completed at each phase of the design process. PREREQ: ECE 310, ECE 330, ECE 350 and ECE 380.
ECE 482 SENIOR DESIGN PROJECT II (2-3-3)(S)(FF). Part two of the capstone design experience integrating previous design work with design theory and methodology. Applied through group project to integrate specifications based upon customer and engineering requirements, computer modeling, simulation, and reliability analysis. Includes a series of project reports, formal presentations, and a written report. Development of skills used in the engineering profession: teamwork, effective meetings, safety, ethics, project management, and time management. PREREQ: ECE 480.